30 June 2026 Gartner names Infineon as company to beat in AI data-center power semiconductors In the report ‘AI Vendor Race: Infineon Is the Company to Beat in AI Data Center Power Semiconductors’ by Menglin Cao and Rajeev Rajput issued on 18 May, Gartner Inc examined the fast-evolving market for AI data-center power semiconductors and identified Infineon Technologies AG of Munich, Germany as “the company to beat” in this space. The report cites Infineon’s “comprehensive product portfolio, manufacturing capabilities and early investment in advanced technologies” as the decisive factors behind its company-to-beat status. According to Gartner, Infineon’s front-runner position is being tested by growing competition in silicon carbide (SiC) and gallium nitride (GaN) and by rivals focused on the compute board level, dynamics that Infineon is actively addressing through its broad portfolio and system-level expertise. As portfolio breadth and system-level expertise emerge as defining capabilities for AI data-center operators seeking to scale sustainably, Infineon projects €2.5bn in AI market revenue for its fiscal year 2027, underpinned by what is said to be the leading portfolio position across the AI power delivery chain. Broad portfolio spanning the entire power delivery chain Gartner recognizes that Infineon secures its position in the AI data-center semiconductor market through a comprehensive ‘grid-to-core’ solution across the entire power delivery architecture, which strategically addresses the unprecedented power density and the thermal bottlenecks of high-performance AI workloads. While many competitors address only isolated stages of the data-center power chain, Infineon says that it delivers optimized semiconductor solutions at every conversion stage, from solid-state transformers (SST), power supply units (PSU) and energy storage systems (ESS) to intermediate bus conversion (IBC) and processor-level power management, ensuring that efficiency, reliability and performance are maximized across the entire system. By optimizing every link in the power delivery chain with the right semiconductor technology at each stage, Infineon enables data-center operators to reduce cumulative energy losses across multiple conversion stages, a critical advantage at hyperscale and a meaningful contribution to the industry’s broader sustainability goals. SiC and GaN: the right technology at every stage Reinforcing Infineon’s broad portfolio is its strategic combination of semiconductor materials. Gartner notes that Infineon’s strategic and early investments in wide-bandgap (WBG) semiconductors, including SiC and GaN, give it critical ad vantages in offering energy-efficient power solutions, particularly for next-generation 800VDC AI data centers. By seamlessly integrating advanced WBG materials – specifically SiC for high-efficiency, high-voltage grid-to-rack conversions and GaN for ultra-dense, high-frequency intermediate power stages – alongside traditional silicon (Si) at the processor level, Infineon minimizes energy loss at each conversion step. From powering AI data centers to physical AI Infineon continues to expand its partnerships across the AI value chain, working closely with system integrators, data-center operators and technology leaders to accelerate the development of next-generation power architectures. Beyond the data center, Infineon says that its semiconductor solutions bring physical AI to life, enabling humanoid robots, collaborative machines and autonomous systems to perceive, think and act safely and securely. With expertise spanning microcontrollers, power systems, sensing, connectivity, functional safety and security, Infineon partners across the full spectrum of physical AI platforms. With the global robotics market projected to reach up to $1.7 trillion by 2050 and 300 million humanoids operating worldwide (UBS Research, 2025), and an estimated average semiconductor bill of materials (BOM) of $500 per humanoid robot, physical AI represents one of the most significant growth opportunities of the coming decades. From the utility grid to the processor core, and from the data center to the factory floor, Infineon powers the full arc of the AI era, the firm notes.

Gartner 将英飞凌评为人工智能数据中心功率半导体领域最值得关注的公司

在5月18日由曹梦麟和Rajeev Rajput撰写的题为《AI供应商竞争：英飞凌是AI数据中心功率半导体领域最强劲的竞争对手》的报告中，Gartner公司对快速发展的AI数据中心功率半导体市场进行了分析，并将总部位于德国慕尼黑的英飞凌科技股份公司（Infineon Technologies AG）评为该领域的“领头羊”。报告指出，英飞凌“全面的产品组合、强大的制造能力以及对先进技术的早期投资”是其成为领头羊的关键因素。Gartner表示，英飞凌的领先地位正受到碳化硅（SiC）和氮化镓（GaN）领域日益激烈的竞争以及专注于计算板级应用的竞争对手的挑战，而英飞凌正凭借其广泛的产品组合和系统级专业知识积极应对这些挑战。

随着产品组合的广度和系统级专业知识成为人工智能数据中心运营商寻求可持续扩展的关键能力，英飞凌预计其 2027 财年的人工智能市场收入将达到 25 亿欧元，这得益于其在人工智能电源输送链中领先的产品组合地位。

涵盖整个电力输送链的广泛产品组合

Gartner 认为，英飞凌凭借其覆盖整个供电架构的“电网到核心”全面解决方案，巩固了其在人工智能数据中心半导体市场的地位。该解决方案从战略层面应对了高性能人工智能工作负载前所未有的功率密度和散热瓶颈。许多竞争对手仅关注数据中心供电链中的个别环节，而英飞凌表示，其在每个转换阶段都提供优化的半导体解决方案，涵盖固态变压器 (SST)、电源单元 (PSU)、储能系统 (ESS)、中间总线转换 (IBC) 以及处理器级电源管理，从而确保整个系统的效率、可靠性和性能最大化。

通过在电力输送链的每个环节采用合适的半导体技术进行优化，英飞凌能够帮助数据中心运营商减少多个转换阶段的累积能源损耗，这在超大规模数据中心中是一项关键优势，也是对行业更广泛的可持续发展目标的重要贡献。

碳化硅和氮化镓：每个阶段都适用的正确技术

英飞凌广泛的产品组合得益于其对半导体材料的战略性组合。Gartner 指出，英飞凌对宽禁带 (WBG) 半导体（包括碳化硅 (SiC) 和氮化镓 (GaN)）的战略性早期投资，使其在提供节能电源解决方案方面拥有关键优势，尤其是在下一代 800VDC AI 数据中心领域。通过在处理器层面将先进的 WBG 材料（特别是用于高效高压电网到机架转换的碳化硅和用于超高密度高频中间功率级的氮化镓）与传统硅 (Si) 无缝集成，英飞凌最大限度地减少了每个转换步骤中的能量损失。

从为人工智能数据中心供电到物理人工智能

英飞凌持续拓展其在人工智能价值链上的合作伙伴关系，与系统集成商、数据中心运营商和技术领导者紧密合作，加速下一代电源架构的开发。

除了数据中心之外，英飞凌表示，其半导体解决方案赋予物理人工智能以生命力，使人形机器人、协作机器和自主系统能够安全可靠地感知、思考和行动。凭借涵盖微控制器、电源系统、传感、连接、功能安全和安防等领域的专业知识，英飞凌与众多合作伙伴携手，共同打造全方位的物理人工智能平台。据瑞银研究（UBS Research，2025）预测，到2050年，全球机器人市场规模将达到1.7万亿美元，届时全球将有3亿个人形机器人投入使用，而每个人形机器人的平均半导体物料清单（BOM）成本约为500美元。因此，物理人工智能代表着未来几十年最重要的增长机遇之一。英飞凌指出，从电网到处理器核心，从数据中心到工厂车间，英飞凌为人工智能时代的整个发展进程提供动力。